Title
Poly-Si gate electrodes for AlGaN/GaN HEMT with high reliability and low gate leakage current.
Abstract
AlGaN/GaN HEMT with a BF2-implanted polycrystalline Si gate has been characterized through comparison to TiN gate electrodes. Positive threshold voltage (Vth) shift was observed with the addition of F ions, which in turn degraded the effective electron mobility (μeff) by diffusion into the AlGaN/GaN interface and GaN layer. A large reduction in gate leakage current (Jg) was achieved and the property was maintained even after strong reverse-bias stressing. No additional degradation in μeff was observed, suggesting the formation of a stable poly-Si/AlGaN interface. Therefore, poly-Si gate electrodes have advantages in reducing the Jg and robustness against reverse-bias stressing.
Year
DOI
Venue
2016
10.1016/j.microrel.2016.05.014
Microelectronics Reliability
Keywords
Field
DocType
Poly-Si gate,Schottky gate,Gate leakage current,Reverse-bias stress,GaN HEMT
Tin,Time-dependent gate oxide breakdown,Electronic engineering,Gate dielectric,Gate oxide,Engineering,High-electron-mobility transistor,Threshold voltage,Electron mobility,Electrode
Journal
Volume
ISSN
Citations 
63
0026-2714
0
PageRank 
References 
Authors
0.34
2
5
Name
Order
Citations
PageRank
J. Chen100.34
Hitoshi Wakabayashi233.95
Kazuo Tsutsui369.26
Hiroshi Iwai41212.99
Kuniyuki Kakushima5911.63