Name
Abstract | ||
|---|---|---|
Developing paradigm in high speed communication device is heterogeneous 3D integration of electronic components - designed on standard silicon wafers - and photonics, optimized in different processes. This paper shows the advantages of 3D integration and presents the measured results of two receivers fabricated in 0.35 μm SiGe BiCMOS technology. The first is a 10 Gbit/s regulated cascode (RGC) based receiver for optical communications and the second is a 200 Mbit/s TIA for monitoring the operating point of the photonic ring modulator. |
Year | DOI | Venue |
|---|---|---|
2016 | 10.1109/DDECS.2016.7482450 | 2016 IEEE 19th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS) |
Keywords | Field | DocType |
optical communication,hybrid 3D integration,transimpedance amplifier (TIA),SiGe BiCMOS,10 Gbit/s | Ring modulation,BiCMOS,Operating point,Cascode,Optical communication,Computer science,Electronic engineering,Electronic component,Photonics,Photodiode | Conference |
Citations | PageRank | References |
0 | 0.34 | 3 |
Authors | ||
6 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Dinka Milovancev | 1 | 0 | 0.68 |
| P. Brandl | 2 | 3 | 2.15 |
| Nemanja Vokic | 3 | 0 | 0.34 |
| Bernhard Goll | 4 | 15 | 6.08 |
| Kerstin Schneider-Hornstein | 5 | 10 | 3.55 |
| Horst Zimmermann | 6 | 10 | 2.53 |