Title
Electrical analysis on implantation-related defect by nanoprobing methodology.
Abstract
Implantation is the key process in the modern semiconductor process which forms the basic device cell by different doping ditribution, depth, angle and element type. They are the key factors to affect the transistor performance, but the implantation-related defect is invisible by the normal failure analysis method. Then electrical analysis and verification is necessary to visualize this kind of defect. Electrical theory is important in this kind of failure analysis to indirectly proven the problematic process. The transistor body effect is a well know effect which is utilized in some kind of IC design to change the transistor Vth for certain purpose. But nobody uses this effect for the implantation-related failure analysis since the implant itself is complex and is not ideally uniform as the theory model. In this paper, implantation-related defect was successfully identified by the application of transistor body effect combined with nanoprobing on the localized structure.
Year
DOI
Venue
2016
10.1016/j.microrel.2016.07.091
Microelectronics Reliability
Field
DocType
Volume
Nanoprobing,Semiconductor device fabrication,Electrical analysis,Electronic engineering,Integrated circuit design,Engineering,Transistor
Journal
64
ISSN
Citations 
PageRank 
0026-2714
0
0.34
References 
Authors
0
9
Name
Order
Citations
PageRank
C. Q. Chen102.37
P. T. Ng200.68
G. B. Ang311.98
He-Ping Tan411.37
Francis Rivai501.01
Y. Z. Ma600.34
H. P. Ng700.68
Jeffery Lam800.68
Z. H. Mai914.34