Name
Title | ||
|---|---|---|
Application of laser deprocessing technique in PFA on chemical over-etched on bond-pad issue. |
Abstract | ||
|---|---|---|
With technology scaling of semiconductor devices and further growth of the integrated circuit (IC)11Integrated Circuit (IC). design and function complexity, the package size has shrank down proportionally too. Hence, flip-chip solder bump mounting is the current semiconductor devices trend to replace the wire bonding technology. |
Year | DOI | Venue |
|---|---|---|
2016 | 10.1016/j.microrel.2016.07.057 | Microelectronics Reliability |
Keywords | Field | DocType |
Laser deprocessing technique,Chemical over-etched,Over-etched bond-pad issue | Bond,Etching,Technology scaling,Wire bonding,Laser,Electronic engineering,Soldering,Engineering,Semiconductor device,Electrical engineering,Optoelectronics,Integrated circuit | Journal |
Volume | ISSN | Citations |
64 | 0026-2714 | 0 |
PageRank | References | Authors |
0.34 | 0 | 12 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| H. H. Yap | 1 | 0 | 0.68 |
| P. K. Tan | 2 | 0 | 1.35 |
| L. Zhu | 3 | 0 | 1.01 |
| H. Feng | 4 | 0 | 0.68 |
| Y. Z. Zhao | 5 | 0 | 0.34 |
| R. He | 6 | 0 | 0.34 |
| H. Tan | 7 | 0 | 1.35 |
| B. Liu | 8 | 0 | 0.68 |
| Yueh-Min Huang | 9 | 2455 | 278.09 |
| D. D. Wang | 10 | 0 | 1.35 |
| J. Lam | 11 | 0 | 0.34 |
| Z. H. Mai | 12 | 1 | 4.34 |