Paper Info
Title
Advanced packaging for wireless sensor nodes in cyber-physical systems - impacts of multifunctionality and miniaturization on the environment
Abstract
Advances in microsystem technology have led to an increasing trend of cyber physical system integration into industrial environments for prognostic health monitoring. Harsh environmental conditions require wireless sensor nodes (WSNs) that are robustness and reliable whilst meeting the requirements of miniaturization, functional integrity and energy efficiency at the same time. Moreover design and application of WSNs need to meet the target of an optimized trade-off between direct impacts associated with the life cycle of the electronics as well as indirect impacts triggered through the usage of electronics. In this contribution, functionally equivalent sensor designs are discussed that represent three evolutionary stages of electronics packaging. The most advanced sensor generation presented applies size-optimized routing, embedded active and passive devices and bare-die assembly. The results of a life-cycle based environmental assessment conducted for the three concepts of WSNs are presented. The study allows for the quantification and comparison of environmental impacts associated with the process of miniaturizing cyber physical system hardware by means of advanced packaging.
Year
DOI
Venue
2017
10.1109/ICPHM.2017.7998324
2017 IEEE International Conference on Prognostics and Health Management (ICPHM)
Keywords
Field
DocType
Micro systems technology,advanced packaging,environmental assessment,eco-design,cyber-physical systems
Microsystem,Key distribution in wireless sensor networks,Efficient energy use,Electronic packaging,Cyber-physical system,Electronics,Systems architecture,Engineering,Wireless sensor network,Embedded system
Conference
ISBN
Citations 
PageRank 
978-1-5090-5711-5
0
0.34
References 
Authors
1
5
Name
Order
Citations
PageRank
Eduard Wagner100.34
Christian Bohme200.34
Stephan Benecke300.34
Nils N. Nissen400.34
K. Dieter Lang5107.04