Name
Abstract | ||
|---|---|---|
In some applications, electronic systems are expected to operate at high ambient temperature (e.g. 150°C). In this paper, we investigate the failure mechanism and microstructure evolution of solder-free (SAC) solder joints at a maximum temperature of 175°C. It is found that no new failure mechanisms are triggered, and that ageing tests for solder can be accelerated at 175°C. In particular, the growth rate of the interfacial intermetallic compound (IMC) is found to be consistent with that observed at lower temperatures. |
Year | DOI | Venue |
|---|---|---|
2017 | 10.1016/j.microrel.2017.06.065 | Microelectronics Reliability |
Keywords | Field | DocType |
Surface-mount assemblies,Intermetallic compounds | Ageing,Microstructure,Maximum temperature,Intermetallic,Microelectronics,Electronic systems,Soldering,Metallurgy,Engineering | Journal |
Volume | ISSN | Citations |
76 | 0026-2714 | 0 |
PageRank | References | Authors |
0.34 | 1 | 7 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Wissam Sabbah | 1 | 3 | 1.48 |
| Pierre Bondue | 2 | 0 | 0.34 |
| Oriol Avino-Salvado | 3 | 1 | 0.70 |
| Cyril Buttay | 4 | 51 | 9.33 |
| Hélène Frémont | 5 | 20 | 12.71 |
| Alexandrine Guédon-Gracia | 6 | 4 | 4.28 |
| Hervé Morel | 7 | 19 | 7.15 |