Name
Abstract | ||
|---|---|---|
With increasing temperature and current density, electromigration (EM) becomes a major interconnect reliability concern for 3-D integrated-circuits (3-D ICs). In 3-D power delivery networks, local vias are used inside power/ground (P/G) through-silicon-vias (TSVs) for vertical power delivery, which are susceptible to EM effects. In order to improve the EM reliability of P/G TSVs, it is desirable t... |
Year | DOI | Venue |
|---|---|---|
2017 | 10.1109/TVLSI.2017.2716821 | IEEE Transactions on Very Large Scale Integration (VLSI) Systems |
Keywords | Field | DocType |
Through-silicon vias,Routing,Reliability,Metals,Resource management,Power system reliability | Current density,Resource management,Computer science,Electronic engineering,Routing congestion,Electromigration,Interconnection,Electrical engineering | Journal |
Volume | Issue | ISSN |
25 | 10 | 1063-8210 |
Citations | PageRank | References |
1 | 0.36 | 28 |
Authors | ||
2 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Shengcheng Wang | 1 | 13 | 4.29 |
| Mehdi B. Tahoori | 2 | 1537 | 163.44 |