Name
Abstract | ||
|---|---|---|
For future exascale computing systems, ultra-high-density memories would be required that consume low power to process massive data. Of the various memory devices, 3D-stacked DRAMs using TSVs are a perfect solution for this purposes. In addition to providing high capacity, these provide functional flexibility to the computing system by attaching a logic die in each 3D-stacked DRAM chip. However, t... |
Year | DOI | Venue |
|---|---|---|
2018 | 10.1109/TC.2017.2723392 | IEEE Transactions on Computers |
Keywords | Field | DocType |
Memory management,Pins,Radiation detectors,Central Processing Unit,DRAM chips,Registers | Dram,Exascale computing,Central processing unit,Computer science,Page table,Parallel computing,Static random-access memory,Real-time computing,Memory management,Computer hardware,Memory rank,Memory refresh | Journal |
Volume | Issue | ISSN |
67 | 1 | 0018-9340 |
Citations | PageRank | References |
1 | 0.34 | 11 |
Authors | ||
6 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Ho Hyun Shin | 1 | 1 | 0.34 |
| Young Min Park | 2 | 1 | 1.02 |
| Duheon Choi | 3 | 1 | 0.68 |
| Byoung Jin Kim | 4 | 1 | 0.34 |
| Dae-Hyung Cho | 5 | 1 | 0.34 |
| Eui-Young Chung | 6 | 635 | 71.51 |