Paper Info
Title
Failure Analysis of Plastic Packages for Low-Power ICs
Abstract
The paper analyses the trend in packaging for low-power integrated circuits (IC) and the principal failures that can occur. A Fault-tree (FT) analysis is proposed, as well an analysis of the failure distribution (FD), which can be useful in safety-critical applications such as industrial and automotive.
Year
DOI
Venue
2016
10.1007/978-3-319-55071-8_21
Lecture Notes in Electrical Engineering
Keywords
DocType
Volume
Failure mode and effect analysis (FMEA),Functional safety,Automotive electronics,Integrated Circuits (ICs),Packaging
Conference
429
ISSN
Citations 
PageRank 
1876-1100
0
0.34
References 
Authors
0
3
Name
Order
Citations
PageRank
Sergio Saponara139258.59
Gabriele Ciarpi202.03
Luca Fanucci353282.83