Name
Title | ||
|---|---|---|
Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs. |
Abstract | ||
|---|---|---|
Electromigration (EM) becomes a major reliability concern in 3-D integrated circuits (3-D ICs). To mitigate this problem, a typical solution is to use through-silicon via (TSV) redundancy in a reactive manner, maintaining the operability of a 3-D chip in the presence of EM failures by detecting and replacing faulty TSVs with spares. In this paper, we explore an alternative, more preferred approach... |
Year | DOI | Venue |
|---|---|---|
2018 | 10.1109/TVLSI.2017.2775586 | IEEE Transactions on Very Large Scale Integration (VLSI) Systems |
Keywords | Field | DocType |
Through-silicon vias,Maintenance engineering,Stress,Redundancy,Integrated circuit interconnections | Computer science,Operability,Electronic engineering,Chip,Redundancy (engineering),Electromigration,Integrated circuit,Reliability engineering,Grid,Maintenance engineering | Journal |
Volume | Issue | ISSN |
26 | 3 | 1063-8210 |
Citations | PageRank | References |
1 | 0.37 | 0 |
Authors | ||
5 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Shengcheng Wang | 1 | 13 | 4.29 |
| Taeyoung Kim | 2 | 400 | 41.48 |
| Zeyu Sun | 3 | 30 | 7.63 |
| Xiang-Dong Tan | 4 | 177 | 30.26 |
| Mehdi B. Tahoori | 5 | 1537 | 163.44 |