Name
Abstract | ||
|---|---|---|
The session presents advances in image sensors covering BSI, global shuttering, organic photoconductive film, pixel scaling, dynamic vision, high frame rate imaging, 3D time-of-flight, and SPADs. The first paper, by Sony, presents a BSI global shutter with in-pixel ADC. Then, Panasonic presents a global shutter using organic film with in-pixel noise cancellation. Samsung presents a 0.9μm pixel with complete deep-trench isolation. Sony presents a low-power event-driven imager with motion detection. TSMC presents a 13.5Mpixel BSI image sensor with a readout subsampling architecture that allows 514fps at 720p. NHK presents a high-speed image sensor achieving 8K video up to 480fps. Toshiba presents a LiDAR SoC enabling range measurements up to 200m. Microsoft presents a BSI time-of-flight image sensor with 3.5μm global-shutter pixels with modulation frequencies up to 320MHz. Delft University presents a direct time-of-flight image sensor with modular SPAD-based pixel arrays fabricated in 3D-stacked 45/65nm CMOS. Finally, FBK presents a SPAD array coupled with TDCs to measure spatial correlations of entangled photons at a rate of 800kHz. |
Year | DOI | Venue |
|---|---|---|
2018 | 10.1109/ISSCC.2018.8310192 | 2018 IEEE International Solid - State Circuits Conference - (ISSCC) |
DocType | ISBN | Citations |
Conference | 978-1-5386-2227-8 | 0 |
PageRank | References | Authors |
0.34 | 0 | 3 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Hayato Wakabayashi | 1 | 19 | 3.70 |
| Makoto Ikeda | 2 | 1202 | 207.10 |
| Makoto Ikeda | 3 | 1202 | 207.10 |