Name
Title | ||
|---|---|---|
Interlayer Cooling Network Design for High-Performance 3D ICs Using Channel Patterning and Pruning. |
Abstract | ||
|---|---|---|
Interlayer liquid cooling network has been considered as one of the effective cooling mechanisms for heat dissipation in three dimensional integrated circuits (3D ICs). In this paper, an optimization approach is proposed for 3D IC interlayer cooling network design with consideration of cooling energy minimization and thermal constraints. First, a channel patterning technique is proposed which adop... |
Year | DOI | Venue |
|---|---|---|
2018 | 10.1109/TCAD.2017.2731683 | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems |
Keywords | Field | DocType |
Optimization,Liquid cooling,Solid modeling,Coolants,Heat transfer,Integrated circuits | Network planning and design,Computer science,Heat transfer,Computer cooling,Communication channel,Chip,Electronic engineering,Three-dimensional integrated circuit,Integrated circuit,Energy minimization | Journal |
Volume | Issue | ISSN |
37 | 4 | 0278-0070 |
Citations | PageRank | References |
1 | 0.34 | 0 |
Authors | ||
6 | ||