Abstract | ||
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Next-generation High-Performance Computing (HPC) applications need to tackle outstanding computational complexity while meeting latency and Quality-of-Service constraints. Heterogeneous Multi-Processor Systems-on-Chip (MPSoCs), equipped with a mix of general-purpose cores and reconfigurable fabric for custom acceleration of computational blocks, are key in providing the flexibility to meet the requirements of next-generation HPC. However, heterogeneity brings new challenges to efficient chip thermal management. In this context, accurate and fast thermal simulators are becoming crucial to understand and exploit the trade-offs brought by heterogeneous MPSoCs. In this paper, we first thermally characterize a next-generation HPC workload, the online video transcoding application, using a highly-accurate Infra-Red (IR) microscope. Second, we extend the 3D-ICE thermal simulation tool with a new generic heat spreader model capable of accurately reproducing package surface temperature, with an average error of 6.8% for the hot spots of the chip. Our model is used to characterize the thermal behaviour of the online transcoding application when running on a heterogeneous MPSoC. Moreover, by using our detailed thermal system characterization we are able to explore different application mappings as well as the thermal limits of such heterogeneous platforms. |
Year | DOI | Venue |
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2017 | 10.1109/SAMOS.2017.8344642 | 2017 International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS) |
Keywords | Field | DocType |
thermal characterization,next-generation workloads,heterogeneous MPSoC,High-Performance Computing applications,Quality-of-Service constraints,Heterogeneous MultiProcessor Systems-on-Chip,MPSoCs,general-purpose cores,computational blocks,heterogeneity,next-generation HPC workload,online video transcoding application,3D-ICE thermal simulation tool,thermal behaviour,online transcoding application,thermal limits,heterogeneous platforms,computational complexity,chip thermal management,thermal simulators,package surface temperature,thermal system characterization,application mappings,Infra-Red microscope | Transcoding,Computer science,Quality of service,Chip,Exploit,Heat spreader,Heat sink,MPSoC,Computational complexity theory,Embedded system | Conference |
ISBN | Citations | PageRank |
978-1-5386-3438-7 | 4 | 0.42 |
References | Authors | |
14 | 9 |
Name | Order | Citations | PageRank |
---|---|---|---|
Arman Iranfar | 1 | 28 | 4.48 |
Federico Terraneo | 2 | 56 | 10.95 |
william e simon | 3 | 22 | 4.67 |
Leon Dragic | 4 | 9 | 0.85 |
Igor Piljic | 5 | 4 | 0.42 |
marina zapater | 6 | 54 | 10.70 |
William Fornaciari | 7 | 543 | 67.45 |
Mario Kovac | 8 | 23 | 5.34 |
D. Atienza | 9 | 182 | 24.26 |