Name
Abstract | ||
|---|---|---|
An advanced neurophysiological computing system can incorporate a 3-D integration system composed of emerging nano-scale devices to provide massive parallelism having high speed, low cost, and energy efficient hardware implementation. Due to process technology constraints, a certain amount of redundant through silicon vias (TSVs) and dummy TSVs are always required in a 3-D integrated system. In th... |
Year | DOI | Venue |
|---|---|---|
2018 | 10.1109/TCAD.2017.2760506 | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems |
Keywords | Field | DocType |
Neuromorphics,Three-dimensional displays,Through-silicon vias,Capacitance,Neurons,Biomembranes | Capacitance,Massively parallel,Efficient energy use,Computer science,Neuromorphic engineering,Electronic engineering,Chip,Energy consumption,Computing systems | Journal |
Volume | Issue | ISSN |
37 | 8 | 0278-0070 |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
4 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| M. Amimul Ehsan | 1 | 4 | 1.75 |
| Hongyu An | 2 | 59 | 12.61 |
| Zhen Zhou | 3 | 30 | 12.87 |
| Yang Yi | 4 | 159 | 26.70 |