Name
Title | ||
|---|---|---|
Thermal Stress and Reliability Analysis of TSV-Based 3-D ICs With a Novel Adaptive Strategy Finite Element Method. |
Abstract | ||
|---|---|---|
Thermomechanical stress is one of the most important issues in performance and reliability analysis of through silicon via-based 3-D integrated circuits (3-D ICs), where an accurate numerical approach is generally needed to produce stress models and identify weak points in the structure. In this paper, we propose a knowledge-oriented nonuniform (KONU) refinement strategy for 3-D IC stress simulati... |
Year | DOI | Venue |
|---|---|---|
2018 | 10.1109/TVLSI.2018.2811417 | IEEE Transactions on Very Large Scale Integration (VLSI) Systems |
Keywords | Field | DocType |
Stress,Finite element analysis,Integrated circuit modeling,Reliability,Analytical models,Mathematical model | Polygon mesh,Adaptive strategies,Computer science,A priori and a posteriori,Electronic engineering,Stress (mechanics),Finite element method,Through-silicon via,Rate of convergence,Integrated circuit | Journal |
Volume | Issue | ISSN |
26 | 7 | 1063-8210 |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
6 | ||