Name
Abstract | ||
|---|---|---|
Due to its ultrathin feature, graphene has been recently proposed as diffusion barrier layer for Cu wires. This paper is geared toward developing an equivalent single-conductor (ESC) transmission-line (IT) model for analysis of Cu-graphene interconnects, i.e., Cu wires encapsulated with graphene barriers. Based on the ESC TL model, electrical performances of Cu-graphene interconnects are examined and evaluated. It is shown that the time delay and temperature rise can be reduced by replacing the conventional diffusion barriers in the Cu/low-k interconnect with the graphene barriers. |
Year | DOI | Venue |
|---|---|---|
2018 | 10.1109/ACCESS.2018.2869468 | IEEE ACCESS |
Keywords | Field | DocType |
Cu-graphene interconnect,diffusion barrier layer,equivalent single-conductor (ESC) model,transfer function,time delay | Conductivity,Graphene,Computer science,Diffusion barrier,Phonon,Scattering,Interconnection,Optoelectronics,Distributed computing | Journal |
Volume | ISSN | Citations |
6 | 2169-3536 | 0 |
PageRank | References | Authors |
0.34 | 0 | 7 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Zi-Han Cheng | 1 | 0 | 0.34 |
| Wen-Sheng Zhao | 2 | 0 | 3.72 |
| Da-Wei Wang | 3 | 0 | 3.38 |
| Jing Wang | 4 | 507 | 93.00 |
| Linxi Dong | 5 | 0 | 2.70 |
| Gaofeng Wang | 6 | 24 | 10.09 |
| Wen-yan Yin | 7 | 3 | 4.29 |