Title
Stability and robustness of InAlGaN/GaN HEMT in short-term DC tests for different passivation schemes.
Abstract
On-wafer short term step-stress tests were carried out to evaluate InAlGaN/GaN HEMT devices. Three types of transistor were studied, each one having a specific two dielectric layer passivation. The results of these tests demonstrate that the upper layer of the passivation has a strong impact on the ageing of the devices. When the upper layer is an Al2O3 Atomic Layer Deposited one, the transistors show a better stability of their electrical parameters than those passivated with the other stacks.
Year
DOI
Venue
2018
10.1016/j.microrel.2018.07.142
Microelectronics Reliability
Keywords
Field
DocType
GaN-based HEMT,Wafer level reliability,DC step-stress,HTRB,HTOL
Stack (abstract data type),Robustness (computer science),Electronic engineering,Dielectric layer,Engineering,Transistor,High-electron-mobility transistor,Passivation,Optoelectronics
Journal
Volume
ISSN
Citations 
88
0026-2714
0
PageRank 
References 
Authors
0.34
0
13
Name
Order
Citations
PageRank
M. Oualli193.25
Christian Dua201.01
O. Patard300.68
P. Altuntas400.68
S. Piotrowicz500.34
Piero Gamarra600.34
C. Lacam700.34
J.-C. Jacquet800.34
L. Teisseire900.34
D. Lancereau1000.34
E. Chartier1100.34
C. Potier1200.34
Sylvain L. Delage1322.39