Paper Info
Title
An analytical circuit based nonlinear thermal model for capacitor banks.
Abstract
The thermal couplings among capacitors in a bank could significantly alter the reliability performance compared to a single capacitor. The impact of thermal coupling is becoming stronger for high power density systems due to more stringent constraint in volume. Prior-art studies take into account the thermal coupling effects of a capacitor bank by either Finite Element Method (FEM) or experimental characterization, which are case dependent and time-consuming. This paper proposes a nonlinear mathematical model for capacitor banks based on physics of thermal conduction, convection, and radiation. A simplified version of the model is also obtained and represented by an RC circuit network, which enables computational-efficient thermal stress modeling. The proposed models are convenient to use to support model based sizing of capacitor banks and is scalable for multi-cell rectangle layout. A case study with experimental testing is discussed to verify the accuracy of the models.
Year
DOI
Venue
2018
10.1016/j.microrel.2018.06.112
Microelectronics Reliability
Keywords
Field
DocType
Capacitor,Reliability,Thermal model,Lifetime
Capacitor,Thermal,Nonlinear system,Coupling,Power factor,Finite element method,Electronic engineering,RC circuit,Thermal conduction,Physics
Journal
Volume
ISSN
Citations 
88
0026-2714
0
PageRank 
References 
Authors
0.34
0
2
Name
Order
Citations
PageRank
haoran wang1816.77
Huai Wang22210.05