Name
Abstract | ||
|---|---|---|
Next generation implantable neural interfaces are targeting devices with mm-scale form factors that are freely floating and completely wireless. Scalability to more recording (or stimulation) channels will be achieved through distributing multiple devices, instead of the current approach that uses a single centralized implant wired to individual electrodes or arrays. In this way, challenges associ... |
Year | DOI | Venue |
|---|---|---|
2018 | 10.1109/TBCAS.2018.2853670 | IEEE Transactions on Biomedical Circuits and Systems |
Keywords | Field | DocType |
Coils,Substrates,Implants,Immune system,Silicon,Analytical models,Mathematical model | Microsystem,Wireless power transfer,Specific absorption rate,Wire bonding,Coupling,Computer science,Electronic engineering,Chip,Electromagnetic coil,Planar,Optoelectronics | Journal |
Volume | Issue | ISSN |
12 | 5 | 1932-4545 |
Citations | PageRank | References |
1 | 0.35 | 0 |
Authors | ||
5 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Peilong Feng | 1 | 3 | 2.01 |
| Pyungwoo Yeon | 2 | 48 | 8.04 |
| Yu-Hua Cheng | 3 | 2 | 5.85 |
| Maysam Ghovanloo | 4 | 1090 | 145.62 |
| Timothy G. Constandinou | 5 | 78 | 38.42 |