Name
Title | ||
|---|---|---|
Simplified Thermal Modeling for IGBT Modules With Periodic Power Loss Profiles in Modular Multilevel Converters. |
Abstract | ||
|---|---|---|
One of the future challenges in modular multilevel converters (MMCs) is how to size key components with compromised costs and design margins, while fulfilling specific reliability targets. It demands better thermal modeling compared to the state-of-the-arts in terms of both accuracy and simplicity. Different from two-level power converters, MMCs have inherent dc-bias in arm currents and the power ... |
Year | DOI | Venue |
|---|---|---|
2019 | 10.1109/TIE.2018.2823664 | IEEE Transactions on Industrial Electronics |
Keywords | Field | DocType |
Insulated gate bipolar transistors,Junctions,Thermal stresses,Estimation,Stress,Reliability engineering | Thermal,Power semiconductor device,Converters,Power loss,Insulated-gate bipolar transistor,Control engineering,Modular design,Engineering,Periodic graph (geometry),Benchmarking | Journal |
Volume | Issue | ISSN |
66 | 3 | 0278-0046 |
Citations | PageRank | References |
1 | 0.41 | 0 |
Authors | ||
5 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Yi Zhang | 1 | 270 | 16.65 |
| Huai Wang | 2 | 22 | 10.05 |
| Zhongxu Wang | 3 | 1 | 1.09 |
| Yongheng Yang | 4 | 30 | 15.47 |
| Frede Blaabjerg | 5 | 1195 | 248.32 |