Title
A Pitch-Matched Front-End ASIC With Integrated Subarray Beamforming ADC for Miniature 3-D Ultrasound Probes.
Abstract
This paper presents a front-end application-specified integrated circuit (ASIC) integrated with a 2-D PZT matrix transducer that enables in-probe digitization with acceptable power dissipation for the next-generation endoscopic and catheter-based 3-D ultrasound imaging systems. To achieve power-efficient massively parallel analog-to-digital conversion (ADC) in a 2-D array, a 10-bit 30 MS/s beamfor...
Year
DOI
Venue
2018
10.1109/JSSC.2018.2864295
IEEE Journal of Solid-State Circuits
Keywords
Field
DocType
Array signal processing,Transducers,Imaging,Probes,Delays,Gain,Ultrasonic imaging
Transducer,Front and back ends,Electrical efficiency,Beamforming,Dissipation,Massively parallel,Computer science,Electronic engineering,Application-specific integrated circuit,Integrated circuit
Journal
Volume
Issue
ISSN
53
11
0018-9200
Citations 
PageRank 
References 
3
0.39
0
Authors
11
Name
Order
Citations
PageRank
Chao Chen1113.47
Zhao Chen27625.75
Deep Bera3111.65
Emile Noothout4144.30
Zu-yao Chang5228.75
Mingliang Tan662.53
Hendrik J Vos7102.81
Johan G. Bosch865055.66
Martin D. Verweij930.39
Nico de Jong1051.16
Michiel A. P. Pertijs119024.37