Title
An Advanced Cyber Physical Framework for Micro Devices Assembly.
Abstract
The design and implementation of an Internet of Things (IoT) based cyber physical framework in the context of Industry 4.0 is discussed for the field of micro devices assembly. Such frameworks hold the potential to facilitate rapid and agile collaborations among distributed engineering partners. This paper outlines the key cyber and physical components which collaborate using cloud-based principle...
Year
DOI
Venue
2019
10.1109/TSMC.2017.2733542
IEEE Transactions on Systems, Man, and Cybernetics: Systems
Keywords
Field
DocType
Collaboration,Manufacturing,Modeling,Cloud computing,Industries,Planning
Virtual reality,Systems engineering,Computer science,Knowledge management,Cyber-physical system,Global environmental analysis,Artificial intelligence,The Internet,Motion planning,Internet of Things,Agile software development,Machine learning,Cloud computing
Journal
Volume
Issue
ISSN
49
1
2168-2216
Citations 
PageRank 
References 
5
0.54
16
Authors
4
Name
Order
Citations
PageRank
Joe Cecil16919.18
Sadiq Albuhamood282.06
Aaron Cecil-Xavier351.55
Parameswaran Ramanathan42794271.11