Title
Survey of Photonic and Plasmonic Interconnect Technologies for Intra-Datacenter and High-Performance Computing Communications.
Abstract
Large scale data centers (DC) and high performance computing (HPC) systems require more and more computing power at higher energy efficiency. They are already consuming megawatts of power, and a linear extrapolation of trends reveals that they may eventually lead to unrealistic power consumption scenarios in order to satisfy future requirements (e.g., Exascale computing). Conventional complementar...
Year
DOI
Venue
2018
10.1109/COMST.2018.2839672
IEEE Communications Surveys & Tutorials
Keywords
Field
DocType
Integrated circuit interconnections,Photonics,Energy efficiency,Bandwidth,Plasmons,Optical interconnections,Market research
Exascale computing,Efficient energy use,Computer science,Chip,CMOS,Bandwidth (signal processing),Transimpedance amplifier,Electronics,Electrical engineering,Photonics,Distributed computing
Journal
Volume
Issue
ISSN
20
4
1553-877X
Citations 
PageRank 
References 
5
0.74
0
Authors
10