Title
Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the "Thermal-House".
Abstract
Thermal crosstalk in a highly integrated RRAM array due to the self-heating effect is one of the most critical issues affecting device reliability. In this paper, two types of "thermal-house" structures are proposed to optimize the thermal management of the RRAM array. An in-house developed parallel simulator is employed to study the performance of the proposed thermal house structures in terms of resistance ratio and crosstalk temperature. It is demonstrated that the proposed thermal house structures can help to reduce thermal crosstalk in high-density RRAM arrays. Some suggestions are also provided for further improving the thermal management capability of the thermal houses as well.
Year
DOI
Venue
2019
10.1109/ACCESS.2018.2888572
IEEE ACCESS
Keywords
Field
DocType
Electrothermal simulation,low power consumption,parallel simulator,resistive-switching random access memory (RRAM),thermal-house,thermal management,thermal crosstalk
Parallel simulation,Thermal,Computer science,Thermal management of electronic devices and systems,Electronic engineering,Resistive random-access memory,Distributed computing
Journal
Volume
ISSN
Citations 
7
2169-3536
0
PageRank 
References 
Authors
0.34
0
8
Name
Order
Citations
PageRank
Da-Wei Wang103.38
Wenchao Chen201.01
Wen-Sheng Zhao303.72
Guo-Dong Zhu400.68
Kai Kang55217.47
Pingqi Gao600.34
J. E. Schutt-Aine732.43
Wen-yan Yin834.29