Name
Abstract | ||
|---|---|---|
This work presents the glass reflow process for microsystems. In this process, glass compounded silicon structures are achieved with the help of vacuum cavities under a high temperature. Three applications employing the glass reflow process, through-wafer interconnects, thermal isolation, and optical window, have been proposed and investigated. |
Year | DOI | Venue |
|---|---|---|
2016 | 10.1109/NEMS.2016.7758246 | 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) |
Keywords | DocType | ISSN |
Glass reflow process,through-wafer interconnects,thermal isolation,Glass capillary optical window | Conference | 2474-3747 |
ISBN | Citations | PageRank |
978-1-5090-1948-9 | 0 | 0.34 |
References | Authors | |
3 | 3 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| nguyen van toan | 1 | 0 | 0.68 |
| Suguru Sangu | 2 | 3 | 1.67 |
| takahito ono | 3 | 1 | 2.99 |