Name
Abstract | ||
|---|---|---|
We present results from 400G transceiver development based on the hybrid integration of vertical-cavity surface emitting lasers and photodiode arrays on 3 and 12 μm silicon-on-insulator (SOI) chips. The integration of waveguide circuits, amplifiers and modulators on SOI is also reported. |
Year | DOI | Venue |
|---|---|---|
2017 | 10.1109/ECOC.2017.8345865 | 2017 European Conference on Optical Communication (ECOC) |
Keywords | DocType | ISBN |
400G transceiver development,vertical-cavity surface emitting lasers,photodiode arrays,silicon-on-insulator chips,hybrid integrated thick SOI chips,hybrid integrated III/V chips,waveguide circuit integration,amplifier integration | Conference | 978-1-5386-4993-0 |
Citations | PageRank | References |
0 | 0.34 | 1 |
Authors | ||
8 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Timo Aalto | 1 | 11 | 3.49 |
| mikko harjanne | 2 | 0 | 2.03 |
| Tapani Vehmas | 3 | 0 | 0.34 |
| Mikko Karppinen | 4 | 0 | 1.35 |
| Aila Sitomaniemi | 5 | 0 | 0.34 |
| Antonio Malacarne | 6 | 0 | 2.70 |
| C. Neumeyr | 7 | 5 | 7.18 |
| Johan Bauwelinck | 8 | 53 | 28.01 |