Name
Title | ||
|---|---|---|
In-Line Optical Amplification For Silicon Photonics Platform By Flip-Chip Bonded Inp-Soas |
Abstract | ||
|---|---|---|
We review the hybrid-integration of an InP semiconductor optical amplifier on a silicon photonics chip, and our in-line SOA integration using precise flip-chip bonding technology. We demonstrate the loss-less operation of a 4x4 switch with a 4ch-SOA array. |
Year | DOI | Venue |
|---|---|---|
2018 | 10.1364/ofc.2018.tu2a.4 | 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC) |
DocType | Citations | PageRank |
Conference | 0 | 0.34 |
References | Authors | |
0 | 10 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Takeshi Matsumoto | 1 | 1 | 0.82 |
| Teruo Kurahashi | 2 | 1 | 1.16 |
| Ryotaro Konoike | 3 | 0 | 1.35 |
| Ken Tanizawa | 4 | 2 | 3.58 |
| Keijiro Suzuki | 5 | 4 | 8.60 |
| Ayahito Uetake | 6 | 1 | 1.16 |
| kazumasa takabayashi | 7 | 16 | 2.95 |
| Kazuhiro Ikeda | 8 | 5 | 8.55 |
| Hitoshi Kawashima | 9 | 6 | 11.11 |
| Suguru Akiyama | 10 | 3 | 1.97 |