Title
Ultra-High Bandwidth Inp Iq Modulator Co-Assembled With Driver Ic For Beyond 100-Gbd Cdm
Abstract
We fabricated a driver modulator sub-assembly for beyond 100-GBd CDM by employing an optimized electrode and a co-designed driver IC. The sub-assembly exhibits an ultra-high bandwidth exceeding 67 GHz, which is sufficient for practical implementation. 2018 The Author(s)
Year
DOI
Venue
2018
10.1364/ofc.2018.th4a.2
2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)
DocType
Citations 
PageRank 
Conference
0
0.34
References 
Authors
0
17