Title
GaN Lateral Schottky Diodes with High Baliga's Figure-of-Merit Utilizing Self-Terminated, Low Damage Anode Recessing Technology
Abstract
AlGaN/GaN lateral diodes on silicon are considered very promising for next generation power conversion systems owing to the excellent material properties. Typically, the anode recess is a frequently-used and effective technology in reducing the SBD's V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</sub> and RON,SP [1]. However, the rough surface morphology and poor recess depth control in common dry etching are two critical issues that would lead to an increased leakage current and premature breakdown [2]. In this report, we employ a LPCVD Si <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> N <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</sub> compatible self-terminated, and plasma-free recess technique in an AlGaN/GaN double channel anode-recessed SBD. The anode region is prevented from plasma bombardment and the recess could stop precisely at the upper heterojunction interface with a smooth surface morphology. The SBD with a 15 μm LAC exhibits a low RON,SP of 1.32 mΩ·cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> , a remarkable VON uniformity and a leakage current of ~ 0.2 μA/mm at -300 V. Moreover, with the assistance of high quality LPCVD Si3N4, a 1.2kV breakdown voltage and a high Baliga' s figure-of-merit of 1.1GW/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> are ultimately achieved in the same device.
Year
DOI
Venue
2018
10.1109/DRC.2018.8442184
2018 76th Device Research Conference (DRC)
Keywords
DocType
ISSN
Baliga's Figure-of-Merit,Self-Terminated Low Damage Anode Recessing Technology,power conversion systems,anode region,breakdown voltage,GaN lateral Schottky diodes,smooth surface morphology,upper heterojunction interface,plasma bombardment,plasma-free recess technique,rough surface morphology,anode recess,size 15.0 mum,voltage 1.2 kV,voltage 300.0 V,AlGaN-GaN,Si3N4
Conference
1548-3770
ISBN
Citations 
PageRank 
978-1-5386-3029-7
0
0.34
References 
Authors
0
6
Name
Order
Citations
PageRank
Jingnan Gao100.34
Jin Yufeng289.51
Bing Xie300.34
Cheng P. Wen401.01
Yilong Hao500.68
Maojun Wang601.01