Title
Localized Heating in Mo'I'ei-Based Resistive Memory Devices
Abstract
Layered materials like transition metal dichalcogenides (TMDs) and hexagonal boron nitride (h-BN) have been recently demonstrated as the switching layers in resistive random access memory (RRAM) devices [1]-[3], but their switching mechanisms are not yet well understood. In this work, we show resistive memory switching in MoTe <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> devices and investigate the thermal origins of their switching behavior using scanning thermal microscopy (SThM). We observe localized heating due to the formation of a conductive plug, which is correlated with electro-thermal simulations, providing the first thermal insights into the operation of such RRAM devices.
Year
DOI
Venue
2018
10.1109/DRC.2018.8442153
2018 76th Device Research Conference (DRC)
Keywords
DocType
ISSN
resistive memory devices,hexagonal boron nitride,switching layers,resistive random access memory devices,switching mechanisms,electro-thermal simulations,RRAM devices,TMD,scanning thermal microscopy,transition metal dichalcogenides,SThM,MoTe2,BN
Conference
1548-3770
ISBN
Citations 
PageRank 
978-1-5386-3029-7
0
0.34
References 
Authors
0
5
Name
Order
Citations
PageRank
Isha M. Datye100.34
Miguel Muñoz Rojo200.68
Eilam Yalon301.69
Michal J. Mleczko400.68
Eric Pop55012.07