Name
Abstract | ||
|---|---|---|
Currently, as semiconductor packages are becoming increasing smaller with improved performances, many are being constructed using stacked structures. However, these types of packages are not easy to qualify owing to the potential swelling of the stacked layers. In this paper, we propose a new method for reliability testing that directly measures the adhesion strength using the swelling temperature to assess the reliability of the package. The swelling temperature is the temperature at which a peel-off occurs between the layers. The advantage of the proposed method in comparison with the traditional reliability testing methods is that the proposed method enables a quick assessment of the product reliability. Through testing and actual case studies, we found that the product reliability qualification can be determined solely by measuring the swelling temperature. |
Year | DOI | Venue |
|---|---|---|
2017 | 10.1016/j.microrel.2016.12.013 | Microelectronics Reliability |
Keywords | Field | DocType |
Swelling temperature (Ts),Swelling,Package,Qualification | Adhesion strength,Semiconductor package,Swelling,Electronic engineering,Engineering,Reliability engineering,Semiconductor | Journal |
Volume | ISSN | Citations |
69 | 0026-2714 | 0 |
PageRank | References | Authors |
0.34 | 1 | 2 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| K. H. Song | 1 | 0 | 0.34 |
| J. S. Jang | 2 | 1 | 1.50 |