Title | ||
---|---|---|
Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes. |
Abstract | ||
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Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel neural sensing microsystem with a sensing area of 5 × 5 mm 2 is presented based on 2.5-D through-silicon-via (TSV) integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-powe... |
Year | DOI | Venue |
---|---|---|
2017 | 10.1109/TBCAS.2017.2669439 | IEEE Transactions on Biomedical Circuits and Systems |
Keywords | Field | DocType |
Sensors,Through-silicon vias,Probes,Bonding,Parallel processing,Integrated circuit interconnections | Microsystem,Computer science,Somatosensory evoked potential,Parallel processing,Communication channel,Converters,Electronic engineering,Local field potential,Amplifier | Journal |
Volume | Issue | ISSN |
11 | 5 | 1932-4545 |
Citations | PageRank | References |
0 | 0.34 | 7 |
Authors | ||
15 |
Name | Order | Citations | PageRank |
---|---|---|---|
Yu-Chieh Huang | 1 | 25 | 6.01 |
Po-Tsang Huang | 2 | 1 | 1.06 |
shanglin wu | 3 | 46 | 7.90 |
Yu-Chen Hu | 4 | 0 | 0.34 |
Yan-Huei You | 5 | 0 | 0.34 |
Ming Chen | 6 | 581 | 85.60 |
Yan-Yu Huang | 7 | 0 | 0.34 |
Hsiao-Chun Chang | 8 | 0 | 0.34 |
Yen-Han Lin | 9 | 0 | 0.34 |
Jeng-Ren Duann | 10 | 3 | 1.40 |
Tzai-Wen Chiu | 11 | 1 | 1.09 |
Wei Hwang | 12 | 1 | 1.74 |
Kuan-Neng Chen | 13 | 142 | 22.06 |
Ching-Te Chuang | 14 | 465 | 76.52 |
J. C. Chiou | 15 | 1 | 1.75 |