Title
Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes.
Abstract
Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel neural sensing microsystem with a sensing area of 5 × 5 mm 2 is presented based on 2.5-D through-silicon-via (TSV) integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-powe...
Year
DOI
Venue
2017
10.1109/TBCAS.2017.2669439
IEEE Transactions on Biomedical Circuits and Systems
Keywords
Field
DocType
Sensors,Through-silicon vias,Probes,Bonding,Parallel processing,Integrated circuit interconnections
Microsystem,Computer science,Somatosensory evoked potential,Parallel processing,Communication channel,Converters,Electronic engineering,Local field potential,Amplifier
Journal
Volume
Issue
ISSN
11
5
1932-4545
Citations 
PageRank 
References 
0
0.34
7
Authors
15
Name
Order
Citations
PageRank
Yu-Chieh Huang1256.01
Po-Tsang Huang211.06
shanglin wu3467.90
Yu-Chen Hu400.34
Yan-Huei You500.34
Ming Chen658185.60
Yan-Yu Huang700.34
Hsiao-Chun Chang800.34
Yen-Han Lin900.34
Jeng-Ren Duann1031.40
Tzai-Wen Chiu1111.09
Wei Hwang1211.74
Kuan-Neng Chen1314222.06
Ching-Te Chuang1446576.52
J. C. Chiou1511.75