Title
Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect.
Abstract
This paper described a low yield case which resulted in a donut shape failing pattern. It also described a scenario where static fault localization is ineffective and a systematic problem solving approach based on symptoms, induction, hypothesis and verification was engaged to resolve the issue with understanding on the root cause and the failure mechanism. The low yield is due to residual light in the dilute HF clean tool which results in photovoltaic electrochemical effect on the exposed metal, through via holes, connecting to large PN junction. This results in subsequent resistive via formation and analogue failure.
Year
DOI
Venue
2017
10.1016/j.microrel.2017.07.036
Microelectronics Reliability
Field
DocType
Volume
Engineering physics,Residual,Nanotechnology,Resistive touchscreen,p–n junction,Electronic engineering,Engineering,Root cause,Electrochemistry,Photovoltaic system
Journal
76
ISSN
Citations 
PageRank 
0026-2714
0
0.34
References 
Authors
1
10
Name
Order
Citations
PageRank
S. P. Neo100.34
A. C. T. Quah210.96
G. B. Ang311.98
D. Nagalingam400.34
H. H. Ma500.34
S. L. Ting600.34
C. W. Soo700.34
C. Q. Chen802.37
Z. H. Mai914.34
Jeffrey Lam1000.34