Title
IBM POWER9 package technology and design.
Abstract
The first-level package that contains the IBM POWER9 processor chip is designed to achieve the high computational performance needed for cognitive systems in a cost-effective design. The throughput data bandwidth of the POWER9 package for high-end scale-up systems is more than 1 TB/s, which is double the data bandwidth of the previous generation. This increase in bandwidth is achieved by introduci...
Year
DOI
Venue
2018
10.1147/JRD.2018.2847178
IBM Journal of Research and Development
Keywords
Field
DocType
Program processors,Computer architecture,Design methodology,System software,Cloud computing,Virtualization
IBM,Computer science,Communication channel,Chip,Electronic engineering,POWER8,Bandwidth (signal processing),PCI Express,Throughput,Cloud computing
Journal
Volume
Issue
ISSN
62
4/5
0018-8646
Citations 
PageRank 
References 
0
0.34
0
Authors
9
Name
Order
Citations
PageRank
Sungjun Chun100.34
Wiren D. Becker221.54
Jon Casey300.34
Steve Ostrander400.34
Daniel Dreps5679.83
Jose Ale Hejase601.01
Ryan Nett7202.78
Brian Beaman800.34
Jason R. Eagle900.34