Name
Abstract | ||
|---|---|---|
Co-packaging high-density optical engines with high-speed electronic switch chips can cut interconnect power consumption in half. Our novel, de-matable, low-profile connector helps by coupling transceivers waveguides to single-mode fiber arrays. |
Year | DOI | Venue |
|---|---|---|
2017 | 10.1109/ECOC.2017.8345870 | 2017 European Conference on Optical Communication (ECOC) |
Keywords | DocType | ISBN |
high-density optical engines,high-speed electronic switch chips,interconnect power consumption,low-profile connector,fiber-to-waveguide connector,transceiver waveguides to single-mode fiber array coupling | Conference | 978-1-5386-4993-0 |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
11 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| lars brusberg | 1 | 1 | 1.05 |
| Michael DeJong | 2 | 0 | 0.34 |
| Margaret Allen | 3 | 0 | 0.34 |
| Ramsey Selim | 4 | 0 | 0.34 |
| Douglas Llewellyn Butler | 5 | 0 | 0.34 |
| Jeffrey S. Clark | 6 | 0 | 0.34 |
| Clifford G. Sutton | 7 | 0 | 0.34 |
| Grahame Wood | 8 | 0 | 0.34 |
| Henk Bulthuis | 9 | 0 | 0.34 |
| Drew Lundsten | 10 | 0 | 0.34 |
| Jamie Stokes | 11 | 0 | 0.34 |