Title
Broadband inductance modeling of TXVs for 3D interconnection
Abstract
In this paper, a broadband closed-form expression for the parasitic inductance of Through-X Vias (TXVs) with a frequency up to 100 GHz is proposed. The rigorous formulas related to the geometrical parameters are derived considering the proximity effect and the skin effect. The proposed model can accurately reflect the change in inductance caused by magnetic flux variation at high frequency. The inductance model is verified by comparing with the 3-D full-wave electromagnetic solver High Frequency Simulator Structure (HFSS) in whole frequency range considered. The proposed model and HFSS results show accordance with each other over large radius range, with a maximum error of 4.6%.
Year
DOI
Venue
2019
10.1016/j.mejo.2019.04.010
Microelectronics Journal
Keywords
Field
DocType
Three-dimensional integrated circuits (3-D ICs),Through X vias (TXVs),Inductance modeling
Parasitic element,Proximity effect (audio),Skin effect,Inductance,HFSS,Electronic engineering,Broadband,Acoustics,Magnetic flux,Engineering,Interconnection
Journal
Volume
ISSN
Citations 
88
0026-2692
0
PageRank 
References 
Authors
0.34
0
5
Name
Order
Citations
PageRank
Yang Liu1136.37
Zhangming Zhu229482.36
Xiaoxian Liu342.45
Li-Xin Guo41216.42
Yin-Tang Yang533492.74