Title
Large Dynamic Range Readout Integrated Circuit for Infrared Detectors
Abstract
Infrared (IR) thermal imaging is an emerging technology with promising industrial, scientific, space and medical applications. In general ROICs are made of using standard silicon technology to collect signals from the Infrared detectors arrays. Typical detector arrays are made on wafers of compound semiconductors, which are then bump bonded to silicon ROICs. ROIC circuit design of direct injection with correlated double sampling (CDS) has been proposed and implemented to meet the readout noise. The large charge handling has been achieved through optimum use of metal oxide semiconductor (MOS) capacitor. CDS removes the correlated noise by subtracting reset noise, offset from the signal. The performance of most of the infrared focal plan arrays (FPAs) are limited by large dark current.This then appears as an offset voltage in the ROIC output. This reduces the actual dynamic range of the ROIC. The offset resulting from dark current can be removed through a proposed skiming circuit which subtracts a preset current from the input current before integration. We have used a current mirror circuit for offset removal. An external off-chip trimming resistor has been provided for adjusting the trimming current. We have archived charge handling capacity of 11Me, readout noise of < 397 electrons and low power of < 128 mW with in pixel size of 30 µm×30 µm of 320×256 ROIC.
Year
DOI
Venue
2019
10.1109/VLSID.2019.00072
2019 32nd International Conference on VLSI Design and 2019 18th International Conference on Embedded Systems (VLSID)
Keywords
Field
DocType
Readout integrated circuit (ROIC), detectors, direct injection (DI), snapshot, Array, Semiconductor Laboratory (SCL), million electron (Me), focal plane array (FPA).
Readout integrated circuit,Computer science,Electronic engineering,Infrared,Large dynamic range,Electrical engineering,Detector
Conference
ISSN
ISBN
Citations 
1063-9667
978-1-7281-0410-2
0
PageRank 
References 
Authors
0.34
3
6