Title
Degradation Monitoring –– from a Vision to Reality
Abstract
This paper describes a reliability degradation modeling and monitoring method based on a combination of IC novel embedded circuits, and off-chip machine learning algorithms which infer the digital readouts of these circuits during test and operational lifetime. Together, they monitor the margin degradation of an IC, as well as other vital parameters of the IC and its environmental stress. This method enables the prevention of future failures, and points to the Physics of Failure, thus estimating the time to failure.
Year
DOI
Venue
2019
10.1109/IRPS.2019.8720527
2019 IEEE International Reliability Physics Symposium (IRPS)
Keywords
Field
DocType
Degradation monitoring,BTI,EM,Stress Migration,software platform,Margin Agents,Profiling Agents,machine learning algorithms and estimators,predictive mantainance,relability,Idsat,Vth,Ioff,HTOL),integrated circuits (IC)
Systems engineering,Electronic engineering,Degradation (geology),Engineering
Conference
ISSN
ISBN
Citations 
1541-7026
978-1-5386-9504-3
0
PageRank 
References 
Authors
0.34
0
12
Name
Order
Citations
PageRank
Evelyn Landman100.34
Shai Cohen200.34
Noam Brousard300.34
Raanan Gewirtzman400.34
Inbar Weintrob500.34
Eyal Fayne600.34
Yahel David700.34
Yuval Bonen800.34
Omer Niv900.34
Shai Tzroia1000.34
Alex Burlak1100.34
J. W. McPherson1200.34