Name
Abstract | ||
|---|---|---|
Stacking the printed circuit boards (PCBs)populated with electronic components one behind the other during SEU tests in neutron beams is a common practice to improve the error statistics. As a result of this stacking, both neutron flux and energy spectrum change from one PCB to another, which may have a significant impact on the results of SEU tests. To quantify these impacts, we measured the neutron attenuation in a stack of test PCBs. We show that the number of transmitted neutrons exponentially decreases as the number of boards grows and we show that this transmission is energy dependent. These results will allow test engineers to correct inaccuracies in the failure-in-time (FIT)rate measurements. |
Year | DOI | Venue |
|---|---|---|
2019 | 10.1109/IRPS.2019.8720477 | 2019 IEEE International Reliability Physics Symposium (IRPS) |
Keywords | Field | DocType |
Neutron radiation effects,neutron beam attenuation,Single event upset (SEU)testing | Neutron radiation,Electronic engineering,Attenuation,Engineering,Semiconductor device,Optoelectronics | Conference |
ISSN | ISBN | Citations |
1541-7026 | 978-1-5386-9504-3 | 0 |
PageRank | References | Authors |
0.34 | 0 | 4 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| S. A. Wender | 1 | 0 | 0.34 |
| J. M. O'Donnell | 2 | 0 | 0.34 |
| L. Zavorka | 3 | 0 | 0.34 |
| B. L. Bhuva | 4 | 5 | 3.40 |