Title
Miniaturized W-Band Gap Waveguide Bandpass Filter Using the MEMS Technique for Both Waveguide and Surface Mounted Packaging
Abstract
A novel miniaturized and light weight W-band bandpass filter (BPF) is proposed based on the gap waveguide (GWG) concept using the micro-electromechanical system (MEMS) technique. The BPF is achieved by cascading four rectangular GWG resonant cavities with designed rectangular and cross-shaped coupling structure. Two standard WR-10 waveguide coupling windows are designed as the input/output couplings, which contributes to the flexible application in various packaging configurations. By utilizing the classical coupling matrix theory, the proposed MEMS GWG BPF is designed to work from 89.8 to 97.4 GHz, which is fabricated by the deep reactive ion etching process using the silicon wafers, and the fabricated silicon wafers are also electroplated and bonded together as a whole structure. The measured insertion loss is within 1.6 dB, and the return losses are larger than 15 dB.
Year
DOI
Venue
2019
10.1109/TCSII.2018.2873236
IEEE Transactions on Circuits and Systems II: Express Briefs
Keywords
Field
DocType
Band-pass filters,Micromechanical devices,Couplings,Loss measurement,Packaging,Electromagnetic waveguides,Silicon
Wafer,Coupling,Microelectromechanical systems,Band-pass filter,Waveguide,Deep reactive-ion etching,W band,Electronic engineering,Insertion loss,Optoelectronics,Mathematics
Journal
Volume
Issue
ISSN
66
6
1549-7747
Citations 
PageRank 
References 
0
0.34
0
Authors
6
Name
Order
Citations
PageRank
Yongrong Shi173.52
Junzhi Zhang200.34
Ming Zhou300.68
Wenjie Feng44512.75
Baolin Cao500.34
Wenquan Che62714.46