Title
Temperature and Gate Leakage Influence on the Z<sup>2</sup>-FET Memory Operation
Abstract
Advanced 28 nm node FD-SOI Z <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> -FETs with thin top-gate insulator are characterized as capacitor-less DRAM cells. Experimental and 2D-TCAD results demonstrate that the memory window shifts while the retention time is reduced as the front-gate geometry is down-scaled or temperature is increased. The degradation of the memory performance can be attributed to gate tunneling current and Generation-Recombination mechanisms. The low-frequency noise and the front-gate leakage current have been experimentally studied, corroborating trap-assisted tunneling as the main degrading contributor under memory operation.
Year
DOI
Venue
2019
10.1109/ESSDERC.2019.8901803
ESSDERC 2019 - 49th European Solid-State Device Research Conference (ESSDERC)
DocType
ISSN
ISBN
Conference
1930-8876
978-1-7281-1540-5
Citations 
PageRank 
References 
0
0.34
0
Authors
7
Name
Order
Citations
PageRank
Carlos Marquez100.34
S. Navarro200.34
Carlos Navarro300.34
N. Salazar400.34
Philippe Galy51712.44
Sorin Cristoloveanu636.73
Francisco Gámiz700.34