Name
Title | ||
|---|---|---|
A Novel Self-Feedback Intelligent Vision Measure for Fast and Accurate Alignment in Flip-Chip Packaging. |
Abstract | ||
|---|---|---|
A template matching (TM) algorithm has been widely employed in a visual inspection process of waferlevel flip-chip packaging, but the structures of traditional TM algorithms are always direct feedforward, which leads to the difficulty in achieving fast speed and high accuracy at the same time. The motivation of this article is to combine the ability to enable the chip visual measurement running in... |
Year | DOI | Venue |
|---|---|---|
2020 | 10.1109/TII.2019.2930078 | IEEE Transactions on Industrial Informatics |
Keywords | Field | DocType |
Packaging,Semiconductor device measurement,Robustness,Visualization,Soldering | Flip chip,Self feedback,Computer science,Control engineering,Computer hardware | Journal |
Volume | Issue | ISSN |
16 | 3 | 1551-3203 |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
9 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Zelong Wu | 1 | 1 | 0.70 |
| Hui Tang | 2 | 2 | 4.12 |
| Zhaoyang Feng | 3 | 0 | 0.34 |
| Weimin Wang | 4 | 0 | 0.34 |
| Sifeng He | 5 | 1 | 2.06 |
| Gao Jian | 6 | 60 | 9.77 |
| Xin Chen | 7 | 3 | 1.06 |
| Yunbo He | 8 | 4 | 3.32 |
| Xun Chen | 9 | 0 | 0.34 |