Title
Large Temperature Coefficient of Resistance in Atomically Thin 2D Devices
Abstract
The temperature coefficient of resistance (TCR) of thin metal lines is often used for applications in thermometry [1], phase change [2], or even thermal accelerometers [3]. However, the TCR of metals drops sharply in films thinner than ~10 nm due to strong surface scattering, preventing their use as ultra-fast thermal sensors, which require reduced thermal mass. In contrast, here we demonstrate for the first time that atomically-thin two-dimensional (2D) materials maintain large TCRs ( >0.5%) even at sub-nm thickness. Fundamentally, these experiments illustrate that transport in high-quality 2D materials remains phonon-limited, unlike ultra-thin metals. From an application standpoint, high TCR in atomically-thin films is expected to enable fast thermal sensors.
Year
DOI
Venue
2019
10.1109/DRC46940.2019.9046401
2019 Device Research Conference (DRC)
Keywords
DocType
ISSN
atomically-thin 2D materials,atomically-thin two-dimensional materials,thermometry,atomically-thin film 2D devices,ultrathin metal drops,ultrafast thermal sensors,high TCR,high-quality 2D materials,thermal mass reduction,surface scattering,thermal accelerometers,metal lines,large temperature coefficient of resistance
Conference
1548-3770
ISBN
Citations 
PageRank 
978-1-7281-2113-0
0
0.34
References 
Authors
0
5
Name
Order
Citations
PageRank
Asir Intisar Khan100.34
Kevin Brenner200.68
Kirby K. H. Smithe300.34
Michal J. Mleczko400.68
Eric Pop55012.07