Title
A Power, Thermal and Reliability-Aware Network-on-Chip
Abstract
Scaling of transistor towards the nano-scale era is continue with every process generation as per Moore's law. The smaller feature size of Complementary Metal-Oxide Semiconductor (CMOS) technology increases the volume of on-chip transistors. Unicore processor's chip design approaches to the end of the line due to the power wall. To accommodate increasing transistor count within power wall, open a new era of computing is called “many-core” architecture. The proliferation of on-chip cores has lead to gain in performance and throughput of chip Multi-Processor (CMP). However, it shifts the paradigm from computational to communicationcentric design. To scale many core communication, Network-on-Chip (NoC) emerges as a solution for many core System-on-Chip (SoC).
Year
DOI
Venue
2017
10.1109/iNIS.2017.55
2017 IEEE International Symposium on Nanoelectronic and Information Systems (iNIS)
Keywords
DocType
ISBN
Moore's law,Complementary Metal-Oxide Semiconductor technology,on-chip transistors,many-core architecture,on-chip cores,core communication,Network-on-Chip,System-on-Chip
Conference
978-1-5386-1357-3
Citations 
PageRank 
References 
0
0.34
11
Authors
6
Name
Order
Citations
PageRank
Ashish Sharma1254.89
Yogendra Gupta200.34
Sonal Yadav332.80
Lava Bhargava464.56
Manoj S. Gaur550163.38
Vijay Laxmi647857.09