Name
Abstract | ||
|---|---|---|
We present a new experimental technique to characterise the crosstalk of a thermopile-based thermal imager, based on bi-directional electrical heating of thermopile elements. The new technique provides a significantly simpler and more reliable method to determine the crosstalk, compared to a more complex experimental setup with a laser source. The technique is used to characterise a novel single-chip array, fabricated on a single dielectric membrane. We propose a theoretical model to simulate the crosstalk, which shows good agreement with the experimental results. Our results allow a better understanding of the thermal effects in these devices, which are at the center of a rising market of industrial and consumer applications. |
Year | DOI | Venue |
|---|---|---|
2020 | 10.3390/s20092573 | SENSORS |
Keywords | DocType | Volume |
infrared sensor,thermopile,CMOS,MEMS,seebeck effect,crosstalk | Journal | 20 |
Issue | ISSN | Citations |
9 | 1424-8220 | 0 |
PageRank | References | Authors |
0.34 | 0 | 8 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Ying Dai | 1 | 0 | 0.34 |
| Syed Zeeshan Ali | 2 | 2 | 1.75 |
| Richard Hopper | 3 | 0 | 0.34 |
| Claudio Falco | 4 | 0 | 0.34 |
| Prakash Pandey | 5 | 0 | 0.34 |
| Chris Oxley | 6 | 0 | 0.34 |
| Daniel Popa | 7 | 14 | 4.10 |
| F. Udrea | 8 | 6 | 6.19 |