Title
Modeling and Optimization of Advanced 3D NAND Memory
Abstract
Development of a new complex technology such as 3D NAND requires significant efforts in terms of materials screening, process tuning, and device design leading to fabrication and characterization of many test wafers with significant time-to-market cost. In this context, modeling can help accelerate 3D NAND technology development. Therefore, in this work, modeling platform is used to investigate such devices. Cross-talk (or cell-to-cell interference) is one of the major concerns in NAND technology, preventing its further scaling. To reduce crosstalk between neighboring cells in this paper, we analyze a 3D NAND structure with separated charge trap regions and compare its performance with the conventional device having continuous charge trap region.
Year
DOI
Venue
2020
10.1109/DRC50226.2020.9135159
2020 Device Research Conference (DRC)
DocType
ISSN
ISBN
Conference
1548-3770
978-1-7281-7047-3
Citations 
PageRank 
References 
0
0.34
0
Authors
8
Name
Order
Citations
PageRank
Mehdi Saremi100.34
Ashish Pal200.34
Liu Jiang300.34
Bazizi, E.M.401.01
Helen Lee500.34
Xi-Wei Lin600.34
Blessy Alexander700.34
Buvna Ayyagari-Sangamalli800.34