Name
Abstract | ||
|---|---|---|
The power devices that are attracting attention in the recent development of electric vehicles, specifically, SiC and GaN power devices (power semiconductors) are expected as key technologies for the 21st century because of high current control and high-frequency operation. However, because of the operating temperature exceeds 300 degrees due to high power, thermal damage on the mounting part of the electronic package cannot be prevented by the present solder technique. We recently developed a metallic nanowire surface fastener (NSF) to resolve the abovementioned problems (Fig. 1). This fastener can be used to connect electronic components on a substrate at room temperature using the van der Waals force between each nanowire. The NSF would be expected to apply huge filed such as wearable devices, assembling of power devices in the inverter of electronic vehicle. This study demonstrates a 64-pin NSF that behaves like a ball grid array for application to actual electronic devices. Additionally, we demonstrate the fabrication of NSF on the flexible substrate. Through the comparison of above both, the adhesion mechanism of NSF is discussed in this present study. We also introduce how to control the adhesion morphology to improve the adhesion strength, electronic conductivity, and thermal conductivity of the NSF. |
Year | DOI | Venue |
|---|---|---|
2019 | 10.1109/MHS48134.2019.9249283 | 2019 International Symposium on Micro-NanoMechatronics and Human Science (MHS) |
DocType | ISSN | ISBN |
Conference | 2474-3763 | 978-1-7281-2676-0 |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
2 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Yuhki Toku | 1 | 0 | 0.34 |
| yang ju | 2 | 1 | 1.16 |