Title
Annealing and Encapsulation of CVD-MoS2 FETs with 10<sup>10</sup>On/Off Current Ratio
Abstract
Mos <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> is a two-dimensional (2D) semi-conductor which is now considered as a channel material in 2D FETs [1]-[3]. Recently we found that single-layer (1L) Mos <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> FETs grown by chemical vapour deposition (CVD) and encapsulated with high-quality Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> layer exhibit superior performance and reliability compared to all previously reported 2D FETs [2]. However, while the <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">I</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</sub> / <i xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">I</i> <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">off</sub> ratio (~10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">9</sup> ) of the devices [2] already fulfills commercial standards, their reliability is still poorer than for Si devices [4]. In order to understand the physical origin of these aspects, here we analyze the impact of annealing at 300°C and Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> deposition on the performance and hysteresis dynamics of 1L MoS <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> FETs.
Year
DOI
Venue
2018
10.1109/DRC.2018.8442242
2018 76th Device Research Conference (DRC)
Keywords
DocType
ISBN
hysteresis dynamics,chemical vapour deposition,single-layer semiconductor device,on-off current ratio,encapsulation,annealing,CVD-MoS2 FETs,two-dimensional semiconductor,temperature 300.0 degC,MoS2
Conference
978-1-5386-3029-7
Citations 
PageRank 
References 
0
0.34
0
Authors
7
Name
Order
Citations
PageRank
Yury Yu. Illarionov100.68
Kirby K. H. Smithe200.34
m waltl323.25
Ryan W. Grady400.34
Sanchit Deshmukh500.34
Eric Pop65012.07
T. Grasser72110.90