Paper Info
Title
CMOS MEMS Thermal Flow Sensor With Enhanced Sensitivity for Heating, Ventilation, and Air Conditioning Application
Abstract
In this article, by using 0.35-μm two-polysilicon four-metal CMOS MEMS technology, a thermoresistive micro calorimetric flow (TMCF) sensor with two packaging designs is systematically investigated: Open-space (O-type) and probe-with-channel (P-type) designs. In comparison with the O-type design, the P-type sensor shows an 80% enhanced sensitivity with a relieved tilt angle effect on the mainstream airflow detection. Accordingly, the P-type packaged flow sensor for HVAC gains a prominent normalized sensitivity (S*) of 228 μV/(m/s)/mW, while also having a low power consumption (P) of less than 4.2 mW. Moreover, within the linear range of -2 to 2 m/s, an accuracy of ±0.05 m/s is achieved, thus enabling this robust flow sensor (repeatability <; 0.2%) for indoor airflow measurements even in a variable ambient environment. Furthermore, the proposed P-type TMCF sensor and its wireless multisensor module are applied for the development of personalized ventilation and the monitoring of predicted mean vote, both of which confirm the functionality of the developed sensor for indoor airflow measurements in the HVAC system.
Year
DOI
Venue
2021
10.1109/TIE.2020.2984446
IEEE Transactions on Industrial Electronics
Keywords
DocType
Volume
Complementary metal–oxide–semiconductor (CMOS) microelectromechanical systems (MEMS),indoor airflow measurement,packaging design,thermal flow sensor,thermoresistive
Journal
68
Issue
ISSN
Citations 
5
0278-0046
1
PageRank 
References 
Authors
0.48
9
6
Name
Order
Citations
PageRank
Wei Xu132938.14
Xiaoyi Wang210.48
Ruijie Wang310.48
Izhar410.48
Jingcui Xu510.48
Yi-Kuen Lee6711.16