Name
Abstract | ||
|---|---|---|
A resonant differential pressure sensor based on bulk silicon technology was put forward in this study. SOI-MEMS technology was employed to fabricate sensor die. A SOI wafer for differential pressure sensing and a GOS (glass on silicon) wafer as a cap were anodically bonded to achieve vacuum packaging for resonators. Finite element simulation was conducted, confirming that the intrinsic resonant f... |
Year | DOI | Venue |
|---|---|---|
2021 | 10.1109/NEMS51815.2021.9451493 | 2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) |
Keywords | DocType | ISSN |
Pressure sensors,Semiconductor device modeling,Performance evaluation,Sensitivity,Nanoelectromechanical systems,Resonant frequency,Packaging | Conference | 2474-3747 |
ISBN | Citations | PageRank |
978-1-6654-1941-3 | 0 | 0.34 |
References | Authors | |
0 | 7 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Chao Cheng | 1 | 0 | 0.34 |
| Yadong Li | 2 | 0 | 0.34 |
| Yulan Lu | 3 | 0 | 0.34 |
| Chao Xiang | 4 | 13 | 3.00 |
| Jian Chen | 5 | 23 | 15.42 |
| Junbo Wang | 6 | 54 | 16.41 |
| Deyong Chen | 7 | 0 | 0.34 |